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CAT25010, CAT25020, CAT25040
1-Kb, 2-Kb and 4-Kb SPI Serial CMOS EEPROM
FEATURES
10 MHz SPI compatible 1.8V to 5.5V supply voltage range SPI modes (0,0) & (1,1) 16-byte page write buffer Self-timed write cycle Hardware and software protection Block write protection - Protect 1/4, 1/2 or entire EEPROM array Low power CMOS technology 1,000,000 program/erase cycles 100 year data retention Industrial and Extended temperature range RoHS-compliant 8-lead PDIP, SOIC, TSSOP and 8-pad TDFN packages
DESCRIPTION
The CAT25010/20/40 are 1-Kb/2-Kb/4-Kb Serial CMOS EEPROM devices internally organized as 128x8/256x8/512x8 bits. They feature a 16-byte page write buffer and support the Serial Peripheral Interface (SPI) protocol. The device is enabled through a Chip Select (CS) input. In addition, the required bus signals are a clock input (SCK), data input (SI) and data output (SO) lines. The HOLD input may be used to pause any serial communication with the CAT25010/20/40 device. These devices feature software and hardware write protection, including partial as well as full array protection.
PIN CONFIGURATION
PDIP (L) SOIC (V) TSSOP (Y) TDFN (VP2) CS SO WP VSS 1 2 3 4 8 VCC 7 HOLD 6 SCK 5 SI
SI CS WP HOLD SCK CAT25010 CAT25020 CAT25040 SO
FUNCTIONAL SYMBOL
VCC
PIN FUNCTION
Pin Name CS SO WP VSS SI SCK HOLD VCC Function Chip Select Serial Data Output Write Protect Ground Serial Data Input Serial Clock Hold Transmission Input Power Supply
VSS
For Ordering Information details, see page 16.
(c) Catalyst Semiconductor, Inc. Characteristics subject to change without notice
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Doc. No. MD-1006 Rev. T
CAT25010, CAT25020, CAT25040
ABSOLUTE MAXIMUM RATINGS(1) Parameters Storage Temperature Voltage on any Pin with Respect to Ground RELIABILITY CHARACTERISTICS(3) Symbol NEND(4) TDR Parameter Endurance Data Retention Min 1,000,000 100 Units Program/ Erase Cycles Years
(2)
Ratings -65 to +150 -0.5 to VCC + 0.5
Units C V
D.C. OPERATING CHARACTERISTICS VCC = +1.8V to +5.5V, TA=-40C to +125C unless otherwise specified.
Symbol Parameter ICC ISB1 ISB2 IL ILO VIL VIH VOL1 VOH1 VOL2 VOH2 Supply Current Standby Current Standby Current Input Leakage Current Output Leakage Current Input Low Voltage Input High Voltage Output Low Voltage Output High Voltage Output Low Voltage Output High Voltage VCC > 2.5V, IOL = 3.0mA VCC > 2.5V, IOH = -1.6mA VCC > 1.8V, IOL = 150A VCC > 1.8V, IOH = -100A VCC - 0.2V VCC - 0.8V 0.2 Test Conditions Read, Write, VCC = 5.0V, SO open VIN = GND or VCC , CS = VCC, = VCC, VCC = 5.0V WP VIN = GND or VCC , CS = VCC, = GND, VCC = 5.0V WP VIN = GND or VCC CS = VCC , VOUT = GND or VCC TA= -40C to +85C TA= -40C to +125C TA= -40C to +85C TA= -40C to +125C -2 -1 -1 -0.5 0.7VCC 10MHz / -40C to 85C 5MHz / -40C to 125C Min Max 2 2 2 4 5 2 1 2 0.3VCC VCC + 0.5 0.4 Units mA mA A A A A A A V V V V V V
PIN CAPACITANCE(3) TA = 25C, f = 1.0MHz, VCC = +5.0V Symbol COUT CIN Test Output Capacitance (SO) Input Capacitance (CS, SCK, SI, , HOLD WP ) Conditions VOUT = 0V VIN = 0V Min Typ Max 8 8 Units pF pF
Notes: (1) Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions outside of those listed in the operational sections of this specification is not implied. Exposure to any absolute maximum rating for extended periods may affect device performance and reliability. (2) The DC input voltage on any pin should not be lower than -0.5V or higher than VCC + 0.5V. During transitions, the voltage on any pin may undershoot to no less than -1.5V or overshoot to no more than VCC + 1.5V, for periods of less than 20ns. (3) These parameters are tested initially and after a design or process change that affects the parameter according to appropriate AEC-Q100 and JEDEC test methods. (4) Page Mode, VCC = 5V, 25C
Doc. No. MD-1006 Rev. T
2
(c) Catalyst Semiconductor, Inc. Characteristics subject to change without notice
CAT25010, CAT25020, CAT25040
A.C. CHARACTERISTICS TA = -40C to +125C, unless otherwise specified.(1) VCC = 1.8V-5.5V Symbol fSCK tSU tH tWH tWL tLZ tRI(2) tFI(2) tHD tCD tV tHO tDIS tHZ tCS tCSS tCSH tWPS tWPH tWC
(4)
VCC = 2.5V-5.5V TA= -40C to +85C Min. DC 20 20 40 40 Max. 10 Units MHz ns ns ns ns 25 2 2 0 10 ns s s ns ns 40 0 20 25 15 15 15 10 10 ns ns ns ns ns ns ns ns ns 5 ms
Parameter Clock Frequency Data Setup Time Data Hold Time SCK High Time SCK Low Time HOLD to Output Low Z Input Rise Time Input Fall Time Setup Time HOLD Hold Time HOLD Output Valid from Clock Low Output Hold Time Output Disable Time HOLD to Output High Z CS High Time CS Setup Time CS Hold Time Setup Time WP Hold Time WP Write Cycle Time
Min. DC 30 30 75 75
Max. 5
50 2 2 0 10 75 0 50 100 50 50 50 10 10 5
Power-Up Timing(2)(3) Symbol tPUR tPUW Parameter Power-up to Read Operation Power-up to Write Operation Max. 1 1 Units ms ms
Notes: (1) AC Test Conditions: Input Pulse Voltages: 0.3VCC to 0.7VCC Input rise and fall times: 10ns Input and output reference voltages: 0.5VCC Output load: current source IOL max/IOH max; CL = 50pF (2) This parameter is tested initially and after a design or process change that affects the parameter. (3) tPUR and tPUW are the delays required from the time VCC is stable until the specified operation can be initiated. (4) tWC is the time from the rising edge of CS after a valid write sequence to the end of the internal write cycle.
(c) Catalyst Semiconductor, Inc. Characteristics subject to change without notice
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Doc. No. MD-1006 Rev. T
CAT25010, CAT25020, CAT25040
PIN DESCRIPTION
SI: The serial data input pin accepts op-codes, addresses and data. In SPI modes (0,0) and (1,1) input data is latched on the rising edge of the SCK clock input. SO: The serial data output pin is used to transfer data out of the device. In SPI modes (0,0) and (1,1) data is shifted out on the falling edge of the SCK clock. SCK: The serial clock input pin accepts the clock provided by the host and used for synchronizing communication between host and CAT25010/20/40. CS: The chip select input pin is used to enable/disable the CAT25010/20/40. When CS is high, the SO output is tri-stated (high impedance) and the device is in Standby Mode (unless an internal write operation is in progress). Every communication session between host and CAT25010/20/40 must be preceded by a high to low transition and concluded with a low to high transition of the CS input. : The write protect input pin will allow all write WP operations to the device when held high. When WP pin is tied low all write operations are inhibited. : HOLD The input pin is used to pause trans- HOLD mission between host and CAT25010/20/40, without having to retransmit the entire sequence at a later time. To pause, HOLD must be taken low and to resume it must be taken back high, with the SCK input low during both transitions. When not used for pausing, the input should be tied to VCC, HOLD either directly or through a resistor.
FUNCTIONAL DESCRIPTION
The CAT25010/20/40 devices support the Serial Peripheral Interface (SPI) bus protocol, modes (0,0) and (1,1). The device contains an 8-bit instruction register. The instruction set and associated op-codes are listed in Table 1. Reading data stored in the CAT25010/20/40 is accom- plished by simply providing the READ command and an address. Writing to the CAT25010/20/40, in addition to a WRITE command, address and data, also requires enabling the device for writing by first setting certain bits in a Status Register, as will be explained later. After a high to low transition on the CS input pin, the CAT25010/20/40 will accept any one of the six instruction op-codes listed in Table 1 and will ignore all other possible 8-bit combinations. The communication protocol follows the timing from Figure 1. Table 1: Instruction Set (1) Instruction WREN WRDI RDSR WRSR READ WRITE Opcode 0000 0110 0000 0100 0000 0101 0000 0001 0000 X011 0000 X010 Operation Enable Write Operations Disable Write Operations Read Status Register Write Status Register Read Data from Memory Write Data to Memory
Note: (1) X = 0 for CAT25010, CAT25020. X = A8 for CAT25040
Figure 1. Synchronous Data Timing
V IH tCS
CS
VIL VIH VIL VIH tSU tCSS tCSH
SCK
tWH tH
tWL
SI
VALID IN
tRI
tFI
VIL tV
tHO
tDIS HI-Z
SO
VOH VOL
HI-Z
Note: Dashed Line = mode (1, 1) - - - - - -
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Doc. No. MD-1006 Rev. T
CAT25010, CAT25020, CAT25040
STATUS REGISTER
The Status Register, as shown in Table 2, contains a number of status and control bits. The (Ready) bit indicates whether the device is RDY busy with a write operation. This bit is automatically set to 1 during an internal write cycle, and reset to 0 when the device is ready to accept commands. For the host, this bit is read only. The WEL (Write Enable Latch) bit is set/reset by the WREN/WRDI commands. When set to 1, the device is Table 2. Status Register 7 1 6 1 5 1 4 1 3 BP1 2 BP0 1 WEL 0 RDY in a Write Enable state and when set to 0, the device is in a Write Disable state. The BP0 and BP1 (Block Protect) bits determine which blocks are currently write protected. They are set by the user with the WRSR command and are non-volatile. The user is allowed to protect a quarter, one half or the entire memory, by setting these bits according to Table 3. The protected blocks then become read-only.
Table 3. Block Protection Bits Status Register Bits BP1 0 0 BP0 0 1 Array Address Protected None CAT25010: 060-07F CAT25020: 0C0-0FF CAT25040: 180-1FF CAT25010: 040-07F CAT25020: 080-0FF CAT25040: 100-1FF CAT25010: 000-07F CAT25020: 000-0FF CAT25040: 000-1FF Protection No Protection Quarter Array Protection
1
0
Half Array Protection
1
1
Full Array Protection
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Doc. No. MD-1006 Rev. T
CAT25010, CAT25020, CAT25040
WRITE OPERATIONS
The CAT25010/20/40 device powers up into a write disable state. The device contains a Write Enable Latch (WEL) which must be set before attempting to write to the memory array or to the status register. In addition, the address of the memory location(s) to be written must be outside the protected area, as defined by BP0 and BP1 bits from the status register. Write Enable and Write Disable The internal Write Enable Latch and the corresponding Status Register WEL bit are set by sending the WREN instruction to the CAT25010/20/40. Care must be taken Figure 2. WREN Timing
CS
to take the CS input high after the WREN instruction, as otherwise the Write Enable Latch will not be properly set. WREN timing is illustrated in Figure 2. The WREN instruction must be sent prior any WRITE or WRSR instruction. The internal write enable latch is reset by sending the WRDI instruction as shown in Figure 3. Disabling write operations by resetting the WEL bit, will protect the device against inadvertent writes.
SCK
SI
0
0
0
0
0
1
1
0
SO
HIGH IMPEDANCE
Note: Dashed Line = mode (1, 1) - - - - - -
Figure 3. WRDI Timing
CS
SCK
SI
0
0
0
0
0
1
0
0
SO
HIGH IMPEDANCE
Note: Dashed Line = mode (1, 1) - - - - - -
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(c) Catalyst Semiconductor, Inc. Characteristics subject to change without notice
CAT25010, CAT25020, CAT25040
Byte Write Once the WEL bit is set, the user may execute a write sequence, by sending a WRITE instruction, a 8-bit address and data as shown in Figure 4. For the CAT25040, bit 3 of the write instruction opcode contains A8 address bit. Internal programming will start after the low to high CS transition. During an internal write cycle, all commands, except for RDSR (Read Status Register) will be ignored. The bit RDY will indicate if the internal write cycle is in progress (RDY high), or the the device is ready to accept commands (RDY low). Page Write After sending the first data byte to the CAT25010/20/40, the host may continue sending data, up to a total of 16 bytes, according to timing shown in Figure 5. After each data byte, the lower order address bits are automatically incremented, while the higher order address bits (page address) remain unchanged. If during this process the end of page is exceeded, then loading will "roll over" to the first byte in the page, thus possibly overwriting previoualy loaded data. Following completion of the write cycle, the CAT25010/20/40 is automatically returned to the write disable state.
Figure 4. Byte WRITE Timing
CS 0 SCK
OPCODE
1
2
3
4
5
6
7
8
13
14
15
16
17
18
19
20
21
22
23
BYTE ADDRESS 0 1 0 A7
DATA IN
SI
0
0
0
0
X*
A0 D7 D6 D5 D4 D3 D2 D1 D0
SO
HIGH IMPEDANCE
Notes: Dashed Line = mode (1, 1) - - - - - * X = 0 for CAT25010, CAT25020. x = A8 for CAT25040
Figure 5. Page WRITE Timing
CS 0 SCK
OPCODE
1
2
3
4
5
6
7
8
13
14
15 16-23 24-31
16+(N-1)x8-1..16+(N-1)x8 16+Nx8-1
BYTE ADDRESS 0 1 0 A7 A0
Data Byte 1
DATA IN Data Byte 2 Data Byte 3 Data Byte N 0 7..1
SI
0
0
0
0
X*
SO
HIGH IMPEDANCE
Notes: Dashed Line = mode (1, 1) - - - - - * X = 0 for CAT25010, CAT25020. x = A8 for CAT25040
(c) Catalyst Semiconductor, Inc. Characteristics subject to change without notice
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Doc. No. MD-1006 Rev. T
CAT25010, CAT25020, CAT25040
Write Status Register The Status Register is written by sending a WRSR instruction according to timing shown in Figure 6. Only bits 2 and 3 can be written using the WRSR command. Write Protection When input is low all write operations to the WP memory array and Status Register are inhibited. WP going low while CS is still low will interrupt a write to the status register. If the internal write cycle has already been initiated, going low will have no WP effect on any write operation to the Status Register. The input timing is shown in Figure 7. WP
Figure 6. WRSR Timing
CS 0 SCK
OPCODE
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
DATA IN
SI
0
0
0
0
0
0
0
1
7
MSB
6
5
4
3
2
1
0
SO
HIGH IMPEDANCE
Note: Dashed Line = mode (1, 1) - - - - - -
Figure 7. Timing WP
t WP S t WPH
CS
SCK
WP
WP
Note: Dashed Line = mode (1, 1) - - - - - -
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(c) Catalyst Semiconductor, Inc. Characteristics subject to change without notice
CAT25010, CAT25020, CAT25040
READ OPERATIONS
Read from Memory Array To read from memory, the host sends a READ instruction followed by a 8-bit address (for the CAT25040, bit 3 of the read instruction opcode contains A8 address bit). After receiving the last address bit, the CAT25010/20/40 will respond by shifting out data on the SO pin (as shown in Figure 8). Sequentially stored data can be read out by simply continuing to run the clock. The internal address pointer is automatically incremented to the next higher address as data is shifted out. After reaching the highest memory address, the address counter "rolls over" to the lowest memory address, and the read cycle can be continued indefinitely. The read operation is terminated by taking CS high. Read Status Register To read the status register, the host simply sends a RDSR command. After receiving the last bit of the command, the CAT25010/20/40 will shift out the contents of the status register on the SO pin (Figure 9). The status register may be read at any time, including during an internal write cycle.
Figure 8. READ Timing
CS 0 SCK
OPCODE
1
2
3
4
5
6
7
8
9
12
13
14
15
16
17
18
19
20
21
22
BYTE ADDRESS
SI
0
0
0
0
X*
0
1
1
A7
A0
DATA OUT
SO
HIGH IMPEDANCE
D7 D6 D5 D4 D3 D2 D1 D0
MSB
Notes: Dashed Line = mode (1, 1) - - - - - * X = 0 for CAT25010, CAT25020. X = A8 for CAT25040
Figure 9. RDSR Timing
CS 0 SCK
OPCODE
1
2
3
4
5
6
7
8
9
10
11
12
13
14
SI
0
0
0
0
0
1
0
1
DATA OUT
SO
HIGH IMPEDANCE
7
MSB
6
5
4
3
2
1
0
Note: Dashed Line = mode (1, 1) - - - - - -
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Doc. No. MD-1006 Rev. T
CAT25010, CAT25020, CAT25040
Hold Operation The input can be used to pause communication HOLD between host and CAT25010/20/40. To pause, HOLD must be taken low while SCK is low (Figure 10). During the hold condition the device must remain selected (CS low). During the pause, the data output pin (SO) is tri-stated (high impedance) and SI transitions are ignored. To resume communication, HOLD must be taken high while SCK is low.
DESIGN CONSIDERATIONS
The CAT25010/20/40 devices incorporate Power-On Reset (POR) circuitry which protects the internal logic against powering up in the wrong state. The device will power up into Standby mode after VCC exceeds the POR trigger level and will power down into Reset mode when VCC drops below the POR trigger level. This bi-directional POR behavior protects the device against `brown-out' failure following a temporary loss of power. The CAT25010/20/40 device powers up in a write disable state and in a low power standby mode. A WREN instruction must be issued prior any writes to the device. After power up, the CS pin must be brought low to enter a ready state and receive an instruction. After a successful byte/page write or status register write, the device goes into a write disable mode. The CS input must be set high after the proper number of clock cycles to start the internal write cycle. Access to the memory array during an internal write cycle is ignored and programming is continued. Any invalid op-code will be ignored and the serial output pin (SO) will remain in the high impedance state.
Figure 10. HOLD Timing
CS tCD SCK tHD HOLD tHZ SO tHD tCD
HIGH IMPEDANCE
tLZ
Note: Dashed Line = mode (1, 1) - - - - - -
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(c) Catalyst Semiconductor, Inc. Characteristics subject to change without notice
CAT25010, CAT25020, CAT25040
PACKAGE OUTLINES DRAWING
PDIP 8-Lead 300mils (L) (1)(2)
SYMBOL
MIN
NOM
MAX
A A1 A2 b
E1
5.33 0.38 2.92 0.36 1.14 0.20 9.02 7.62 6.10 7.87 2.92 3.30 3.30 0.46 1.52 0.25 9.27 7.87 2.54 BSC 6.35 7.11 10.92 3.80 4.95 0.56 1.78 0.36 10.16 8.25
b2 c D E e E1 eB
PIN # 1 IDENTIFICATION D
L
TOP VIEW
E
A
A2
A1 b2 L c
e
b
eB
SIDE VIEW
END VIEW
For current Tape and Reel information, download the PDF file from: http://www.catsemi.com/documents/tapeandreel.pdf.
Notes: (1) All dimensions are in millimeters. (2) Complies with JEDEC specification MS-001
(c) Catalyst Semiconductor, Inc. Characteristics subject to change without notice
11
Doc. No. MD-1006 Rev. T
CAT25010, CAT25020, CAT25040
SOIC 8-Lead 150mils (V) (1)(2)
SYMBOL
MIN
NOM
MAX
A A1 b c
E1 E
1.35 0.10 0.33 0.19 4.80 5.80 3.80 1.27 BSC 0.25 0.40 0
1.75 0.25 0.51 0.25 5.00 6.20 4.00 0.50 1.27 8
D E E1 e h L
PIN # 1 IDENTIFICATION TOP VIEW
D
h
A1
A
c
e
b
L
SIDE VIEW
END VIEW
For current Tape and Reel information, download the PDF file from: http://www.catsemi.com/documents/tapeandreel.pdf.
Notes: (1) All dimensions are in millimeters. (2) Complies with JEDEC specification MS-012.
Doc. No. MD-1006 Rev. T
12
(c) Catalyst Semiconductor, Inc. Characteristics subject to change without notice
CAT25010, CAT25020, CAT25040
TSSOP 8-Lead (Y) (1)(2)
b
SYMBOL
MIN
NOM
MAX
A A1 A2 b c
E1 E
1.20 0.05 0.80 0.19 0.09 2.90 6.30 4.30 3.00 6.40 4.40 0.65 BSC 1.00 REF 0.50 0 0.60 0.75 8 0.90 0.15 1.05 0.30 0.20 3.10 6.50 4.50
D E E1 e L L1 1
e
TOP VIEW
D c
A2
A
1
A1 SIDE VIEW
L1 END VIEW
L
For current Tape and Reel information, download the PDF file from: http://www.catsemi.com/documents/tapeandreel.pdf.
Notes: (1) All dimensions are in millimeters. (2) Complies with JEDEC specification MO-153.
(c) Catalyst Semiconductor, Inc. Characteristics subject to change without notice
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Doc. No. MD-1006 Rev. T
CAT25010, CAT25020, CAT25040
TDFN 8-Pad 2 x 3mm (VP2) (1)(2)
D
A
e
b
E
E2 PIN#1 IDENTIFICATION
A1 PIN#1 INDEX AREA D2 L
TOP VIEW
SIDE VIEW
BOTTOM VIEW
SYMBO L A A1 A2 A3 b D D2 E E2 e L
MIN 0.70 0.00 0.45 0.20 1.90 1.30 2.90 1.20 0.20
NOM 0.75 0.02 0.55 0.20 REF 0.25 2.00 1.40 3.00 1.30 050 TYP 0.30
MAX 0.80 0.05 0.65 0.30 2.10 1.50 3.10 1.40 0.40
A2 A3
FRONT VIEW
For current Tape and Reel information, download the PDF file from: http://www.catsemi.com/documents/tapeandreel.pdf.
Notes: (1) All dimensions are in millimeters. (2) Complies with JEDEC specification MO-229.
Doc. No. MD-1006 Rev. T
14
(c) Catalyst Semiconductor, Inc. Characteristics subject to change without notice
CAT25010, CAT25020, CAT25040
MSOP 8-Lead 3 x 3mm (Z) (1)(2)
SYMBOL
MIN
NOM
MAX
A A1 A2 b c D
E E1
1.10 0.05 0.75 0.22 0.13 2.90 4.80 2.90 0.40 3.00 4.90 3.00 0.65 BSC 0.60 0.95 REF 0.25 BSC 0 6 0.80 0.10 0.85 0.15 0.95 0.38 0.23 3.10 5.00 3.10
E E1 e L L1 L2
TOP VIEW
D
A
A2
DETAIL A
A1
e SIDE VIEW
b
c END VIEW
L2 L L1 DETAIL A
For current Tape and Reel information, download the PDF file from: http://www.catsemi.com/documents/tapeandreel.pdf.
Notes: (1) All dimensions are in millimeters. (2) Complies with JEDEC specification MO-187.
(c) Catalyst Semiconductor, Inc. Characteristics subject to change without notice
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Doc. No. MD-1006 Rev. T
CAT25010, CAT25020, CAT25040
EXAMPLE OF ORDERING INFORMATION (1)(2)
Prefix CAT
Company ID
Device # Suffix 25040 V I
Temperature Range I = Industrial (-40C to +85C) E = Extended (-40C to +125C) Package PDIP SOIC, JEDEC TSSOP TDFN (2 x 3mm) (4) MSOP
-G
Lead Finish G: NiPdAu Blank: Matte-Tin
T3
Product Number 25010: 1-Kb 25020: 2-Kb 25040: 4-Kb
L: V: Y: VP2: Z:
Tape & Reel T: Tape & Reel 3: 3000 units/Reel
Notes: (1) All packages are RoHS-compliant (Lead-free, Halogen-free). (2) The standard lead finish is NiPdAu. (3) The device used in the above example is a CAT25040VI-GT3 (SOIC, Industrial Temperature, NiPdAu, Tape & Reel). (4) For availabitily, please contact your nearest Catalyst Semiconductor Sales office.
(c) Catalyst Semiconductor, Inc. Characteristics subject to change without notice
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Doc. No. MD-1006 Rev. T
REVISION HISTORY
Date 10/13/05 Rev. N Comments Update D.C. Operating Characteristics Update Ordering Information Update Pin Configuration Update D.C. Operating Characteristics Update Pin Impedance Characteristics Update Figure 2, 3, 4, 6, 8 Add Tape and Reel Update Ordering Information Update D.C. Operating Characteristics Update A.C. Characteristics Update Pin Description Update Features Update Description Update A.C. Characteristics Update Package Marking Remove Tape and Reel Update Example of Ordering Information Add TDFN and MSOP packages Update Package Marking Update Ordering Information Update Example of Ordering Information Add Extended Temperature range Updated text format Update D.C. Operating Characteristics table for Extended Temperature range Update A.C. Characteristics table for Extended Temperature range Add MD- to document number
12/09/05
O
03/21/06
P
06/30/06
Q
07/31/06 10/13/06
R S
9/14/07
T
Copyrights, Trademarks and Patents (c) Catalyst Semiconductor, Inc. Trademarks and registered trademarks of Catalyst Semiconductor include each of the following: Beyond MemoryTM, DPPTM, EZDimTM, LDDTM, MiniPotTM and Quad-ModeTM Catalyst Semiconductor has been issued U.S. and foreign patents and has patent applications pending that protect its products. CATALYST SEMICONDUCTOR MAKES NO WARRANTY, REPRESENTATION OR GUARANTEE, EXPRESS OR IMPLIED, REGARDING THE SUITABILITY OF ITS PRODUCTS FOR ANY PARTICULAR PURPOSE, NOR THAT THE USE OF ITS PRODUCTS WILL NOT INFRINGE ITS INTELLECTUAL PROPERTY RIGHTS OR THE RIGHTS OF THIRD PARTIES WITH RESPECT TO ANY PARTICULAR USE OR APPLICATION AND SPECIFICALLY DISCLAIMS ANY AND ALL LIABILITY ARISING OUT OF ANY SUCH USE OR APPLICATION, INCLUDING BUT NOT LIMITED TO, CONSEQUENTIAL OR INCIDENTAL DAMAGES. Catalyst Semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Catalyst Semiconductor product could create a situation where personal injury or death may occur. Catalyst Semiconductor reserves the right to make changes to or discontinue any product or service described herein without notice. Products with data sheets labeled "Advance Information" or "Preliminary" and other products described herein may not be in production or offered for sale. Catalyst Semiconductor advises customers to obtain the current version of the relevant product information before placing orders. Circuit diagrams illustrate typical semiconductor applications and may not be complete.
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Document No: MD-1006 Revision: T Issue date: 9/14/07

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